1. Support new projects on package type selection, necessity of package tooling and bumping, and all other issues related to packaging; 2. Coordinate with customer and subcontractors for package quality and delivery etc; 3. Work with design team for bonding feasibility study and with subcontractors for bonding diagram and package drawing; 4. Manufacturing control, yield analysis and improvement. 5. Document maintain, like BD/POD/Mark. 岗位要求: 1. Bachelor degree or above, Major of Electric or automation. 2. Good knowledge of IC packaging design (BGA, bumping, WLP …) is essential, 7/14/28nm IC package design experience is preferred. 3. Able to manage subcontractors in different locations; 4. Willing to work under pressure.职能类别:封装工程师
关于灿芯半导体
灿芯半导体是一家提供一站式定制芯片及IP的高新技术企业,为客户提供从芯片架构设计到芯片成品的一站式服务,致力于为客户提供高价值、差异化的解决方案。
灿芯半导体的“YOU”系列IP和YouSiP(Silicon-Platform)解决方案,经过了完整的流片测试验证。其中YouSiP方案可以为系统公司、无厂半导体公司提供原型设计参考,从而快速赢得市场。
灿芯半导体成立于2008年,总部位于中国上海,为客户提供全方位的优质服务。
About Brite Semiconductor
Brite Semiconductor is a leading custom ASIC and IP provider, and mitted to provide flexible one-stop services from architecture design to chip delivery with high value and differentiated solutions.
Brite Semiconductor provides prehensive silicon proven “YOU” IP portfolio and YouSiP (Silicon-Platform) solution. YouSiP solution provides a prototype design reference for system house and fabless to speed up the time-to-market.
Founded in 2008, Brite Semiconductor is headquartered in Shanghai, China.